- Pickering Interfaces Inc.
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PCI High Density Pecision Resistor Card, 3-Channel, 4Ω To 2.97MΩ
50-298-151
The 50-298-151 is a high density programmable resistor card with 3 channels which can be set between 4Ω and 2.97MΩ with 0.25Ω resolution The 50-298 range provides a simple solution for applications requiring accurate simulation of resistive sensors. The 40-298 is available in a variety of resistance ranges and resolution capabilities that meet the needs of most functional test systems. It is particularly well suited to applications such as the testing of engine controllers where resistive sensors provide information on parameters such as temperature.
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Memory Test System
T5851/T5851ES
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wi...show more -
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Memory Test System
T5221
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Memory Test System
T5511
Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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Memory Tester
RAMCHECK
RAMCHECK is our most advanced memory tester and is the latest in our product line. Highly modular and user friendly, it redefines the capabilities of an affordable and portable ram checker.
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Memory Tester
RAMCHECK LX DDR3
Quickly test DDR3 DIMM and SO-DIMM memory. In just seconds, RAMCHECK LX will perform a thorough test of the module and provide complete identification. Also tests expensive LRDIMM modules.
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Memory Test Software
Teradyne’s customers count on us for our Near Device Under Test (DUT) technology that gives memory device manufacturers a guaranteed performance advantage. A brief description of dynamic memory and storage memory devices will highlight why device manufacturers depend on Teradyne’s memory test solutions.
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Memory Test System
T5830/T5830ES
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Memory Burn-In Test
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Memory Test Systems
ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
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Memory Test System
T5835
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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DDR4 Pro Memory Test Adapter
This memory test adapter for the RAMCHECK LX includes an extraordinarily rugged test socket for many thousands of insertion/removal cycles.
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Memory Testing
C.C.P. Contact Probes Co., LTD.
Standard and Custom test solutions for RAM, Flash and many other memory chips.
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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell...show more -
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High-Speed Memory Test Solution
UltraFLEX-M
The UltraFLEX-M builds on the advanced test technology and architecture of the proven UltraFLEX test system to ensure high test quality at the lowest cost of test for high-speed memory devices.
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Memory Tester
SP3000
CST is proud to offer a portable stand alone and affordable memory tester, combining DIMM and SODIMM testing capability all on the same universal base unit with optional easy plug-on test adapters.
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Ultra-high Performance Solution for Memory Device Test
Magnum EPIC
Teradyne’s Magnum EPIC is a high-performance test solution for latest generation DRAM devices. These devices are key enablers for technologies like 5G, AI, cloud computing, autonomous vehicles, AR/VR and applications with high definition graphics.
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Memory Test System
T5801
Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
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Memory Test Systems
T5503HS2
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Memory Burn-In Tester
H5620/H5620ES
As Server and Mobile applications have mainly led the Memory and market has also entered a super cycle that has completely withdrawn from the previous silicon cycle.Memory capacitance will continue to rise as the application of data processing and mobile communication occurs—however, revenue will not grow as ASP goes down. Suppliers need to reduce test costs and increase profits.H5620 contributes to reduction of test cost by integrating the test process of DRAM Burn-in and Core Test. This hybrid memory test solution solves the challenge of reducing test costs while increasing test efficiency in the expanding DRAM market.
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QML Memory
DPA Components, International (DPACI) has answered the call by offering our own line of QML Military memory SRAM products.
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Memory Interposers
Memory interposers for logic analyzers and oscilloscopes are ordered by memory type. Please select the memory type/technology of interest.
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Test fixtures
Offers a wide range of standard Test Fixtures that can fit many of your applications and services. From your R & D to your production lines, we have a solution for you.Each products are standard but we can adapt or design your application.
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Test Connectors
A wide range of standard test Connectors that can fit many of your applications and services. We offer a ideal solution for your testing needs in automatic or manual mode.
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Memory Recorder
MR8847A
High-speed 20MS/s, 16-channel, Fully Isolated Memory Recorder for On-site Jobs and R&D
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Reflective Memory
VME-5565
The VME-5565 Reflective Memory node card provides a high-speed, low latency, deterministic interface that allows data to be shared between up to 256 independent systems (nodes) at rates up to 170 Mbyte/s. Each Reflective Memory board can be configured with either 64 Mbyte or 128 Mbyte of onboard SDRAM. The local SDRAM provides fast Read access times to stored data.
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Memory Burn-in Tester
B6700 Series
B6700 can test as many as 48 burn-in boards in parallel at speeds up to 10 MHz, which helps memory suppliers get their newest products to market faster while also reducing testing costs. An original high performance chamber improves yield by assuring high temperature accuracy while generating high temperature. It also shortens the temperature rise and fall time which leads to shortening the test time.
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Memory Module
Advantech Memory module and DRAM modules offer an extensive portfolio of industrial grade memory, like un-buffered DIMMs, LONG-DIMM and SO-DIMM which are designed according to the latest JEDEC standards and cover all technologies from DDR to DDR3 memory in wide temp ranges (-40 to 85C). Advantech Memory module and DRAM modules'' synchronous design allows precise cycle control with the use of system clock. I/O data transactions are possible on both edges of DQS. Range of operation frequencies, and programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.
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